In a high-performance computing system 100 CPU chips, each dissipating 25 W, are attached to one surface of a 200 mm by 200 mm copper heat spreader. The copper plate is cooled on its opposite surface by water, which is tripped at the leading edge of the copper so that the boundary layer is turbulent throughout. The plate may be assumed to be isothermal due to the high thermal conductivity of the copper. The water velocity and temperature are 2 m/s and 17˚C. What is the temperature of the copper plate?
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