2. a package with a heat sink and fan has a thermal resistance to the ambient of 8 °c/w. the thermal resistance from the die to the package is 2 °c/w. if the package is in a chassis that will never exceed 50 °c and the maximum acceptable die temperature is 110 °c, how much power can the chip dissipate?

To solve this problem it is necessary to apply the concepts related to the Power depending on the temperature and the heat transferred.

By definition the power can be expressed as

Where,

Change at the temperature, i.e, the maximum acceptable die temperature () with the allowable temperature in chassis ()

Change in the thermal resistance to ambient () and the Thermal resistance from die to package ()

Our values are given as,

Replacing we have,

The power that can dissipate the chip is 10W

iron would move it is magnetic there is a mag field around the current in the wire

when jerome paddle in flowing river towards east the net speed of jerome will increase

so the net speed of jerome will be given as

now the speed of paul will be same as it is given as he is running on the ground

so

so here we can say since the speed of jerome is more so he will win the race

now as we know the distance so the time difference is given as

so jerome will reach first and the time difference will be 203.55 s or 3.4 min