Engineers, architects, and others who engage in design to solve practical problems use:

The higher the astm grain-size number, the coarser the grain is. a)-true b)-false

Air flows over a heated plate àt a velocity of 50m/s. the local skin factor coefficient at a point on a plate is 0.004. estimate the local heat transfer coefficient at this point. the following property data for air are given: density = 0.88kg/m3 , viscosity 2.286 x 10 ^-5 kgm/s , k = 0.035w/mk ,cp = 1.001kj/kgk. use colburn reynolds analogy.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction