Who creates design problems?

Apiping systems consists of 6 m of 6-std type k and 12 m of 4-std type k, both drawn copper tubing. the system conveys ethylene glycol at a rate of 0.013 m3/s. the pressure drop across the system is to be calculated. there are two 90° elbows in the 6-in pipe, a reduction from the 6-in pipe to the 4-in pipe and four 90° elbows in the 4-in pipe. all fittings are soldered (same as flanged) and regular. the inlet and outlet of the system are at the same height.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction

Two slings are used to lift a girder of length l and uniform weight per unit length. what is the best position for the slings if the bending moment due to the weight of the girder is to be kept to a minimum?