An experiment is performed to determine the boiling characteristics of a special coating applied to the exposed surface. Under steady-state conditions, nucleate boiling is maintained in saturated water at atmospheric pressure, and values of T1 133.7C and T2 158.6C are recorded. If n 1, what value of the coefficient Cs, f is associated with the Rohsenow correlation

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction