Production engineers wish to find the optimal process for etching circuit boards quickly. They create a single replicate 24experiment to test the effect of the following factors on time to etch a circuit board: (A) Concentration of nitric acid in the etchant, (B) temperature of the etchant, (C) stirring rate in the etching tank, (D) surface area of the board. Running this experiment, they obtain the data in HW_EDA_137.csv. Preview the document Which factors effects and interaction effects are significant

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Apump is used to circulate hot water in a home heating system. water enters the well-insulated pump operating at steady state at a rate of 0.42 gal/min. the inlet pressure and temperature are 14.7 lbf/in.2, and 180°f, respectively; at the exit the pressure is 60 lbf/in.2 the pump requires 1/15 hp of power input. water can be modeled as an incompressible substance with constant density of 60.58 lb/ft3 and constant specific heat of 1 btu/lb or. neglecting kinetic and potential energy effects, determine the temperature change, in °r, as the water flows through the pump.

Refrigerant 134a enters an insulated compressor operating at steady state as saturated vapor at -26°c with a volumetric flow rate of 0.18 m3/s. refrigerant exits at 9 bar, 70°c. changes in kinetic and potential energy from inlet to exit can be ignored. determine the volumetric flow rate at the exit, in m3/s, and the compressor power, in kw.