Engineering, 14.04.2020 22:54 yselahernandez02
A silicon carbide plate fractured in bending when a blunt load was applied to the plate center. The distance between the fracture origin and the mirror/mist boundary on the fracture surface was 0.796 mm. To determine the stress used to break the plate, three samples of the same material were tested and produced the following. What is the estimate of the stress present at the time of fracture for the original plate?
Mirror Radius (mm) Bending Failure Stress (MPa)
.603 225
.203 368
.162 442
Answers: 3
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A silicon carbide plate fractured in bending when a blunt load was applied to the plate center. The...
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