A square silicon chip (k = 152 W/m·K) is of width 7 mm on a side and of thickness 3 mm. The chip is mounted in a substrate such that its side and back surfaces are insulated, while the front surface is exposed to a coolant. If 6 W are being dissipated in circuits mounted to the back surface of the chip, what is the steady-state temperature difference between the back and front surfaces?

Inadequate stores control is not an obstacle to effective work order system. (clo4) a)-true b)-false

Derive the correction factor formula for conical nozzle i=-(1+ cosa) and calculate the nozzle angle correction factor for a nozzle whose divergence hal-fangle is 13 (hint: assume that all the mass flow originates at the apex of the cone.

Describe one experiment in which the glass transition temperature and melting temperature of a totally amorphous thermoplastic material can be determined. show the relevant experimental results in a diagram which should be properly annotated with the two temperatures clearly marked. what is likely to happen to the curve in the diagram if the amorphous polymer is replaced by a thermosetting type?