Engineering, 14.09.2019 02:10 Giabear23
Which of the two materials (brittle vs. ductile) usually obtains the highest ultimate strength and why?
Answers: 3
Engineering, 06.07.2019 02:30, khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Engineering, 06.07.2019 03:20, 1xXJOKERXx3
Areaction-bonded silicon nitride ceramic has a strength of 250 mpa and a fracture toughness of 3.4 mpa(m)^1/2, what is the largest-sized internal flaw that this material can support without fracturing? (use y -1 in the fracture-toughness equation.)
Answers: 3
Which of the two materials (brittle vs. ductile) usually obtains the highest ultimate strength and w...
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