Engineering, 13.09.2019 22:30 hollie62
The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.
Answers: 2
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The y form of iron is known as: a) ferrite b) cementite c) perlite d) austenite
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Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.
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Compute the pressure drop of 30°c air flowing with a mean velocity of 8 m/s in a circular sheet-metal duct 300 mm in diameter and 15 m long. use a friction factor, f 0.02, and pair = 1.1644 kg/m a. 37.26 pa b. 25.27 pa n c. 29.34 pa d. 30.52 pa
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The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diamet...
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