Copper (Cu) has D0=0.16 cm^2/sec, ΔH=2.07 eV, and Aluminum (Al) has D0=0.047 cm2/sec, ΔH=1.28 eV.
(a) Calculate the diffusion coefficient: D_Cu and D_Al at 600K.
(b) Calculate D_Cu and D_Al at their melting point. (T_M for Cu is 1083 °C, and for Al is 660 °C).
(c) Which temperature should you consider for the diffusion issue when you select a metal contact for electronic circuit? Why? Which one is better for interconnects, Al or Cu? (Hint: D = Do exp( -ΔH / kT) )
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Copper (Cu) has D0=0.16 cm^2/sec, ΔH=2.07 eV, and Aluminum (Al) has D0=0.047 cm2/sec, ΔH=1.28 eV.
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